Product format / 01
Compact Thermal Core
640 × 512 reference platform designed for compact integration and system-level configuration.
- Core assembly
- Module integration
- Calibration
- Functional testing
- Interface integration
Infrared Imaging · Electronic Manufacturing · Engineering
Thermal imaging solutions built for integration.
ELX TECHNOLOGY ENGINEERING develops and manufactures compact thermal imaging cores, camera-level products and integrated infrared solutions for industrial applications.
Compact thermal camera640 / LWIR
Featured thermal platform / 01
640 × 512 Compact Thermal Imaging Platform
Compact LWIR thermal core and camera-level configurations designed for integration into industrial and intelligent systems.
- Resolution
- 640 × 512
- Pixel pitch
- 12 μm
- Detector
- Uncooled VOx microbolometer
- Spectral range
- 8–14 μm
- NETD
- ≤40 mK @ 300 KReference
- Frame rate
- ≤50 HzReference
- Typical core power
- ≤0.6 WReference
Reference values describe the current platform. Final mechanics, packaging, interfaces and performance are confirmed by project requirements.
Two product formats / 02
Configurable from compact core to camera-level product.
Product scope can be coordinated around the host system, mechanical envelope, interfaces and intended application.
Product format / 02
Compact Thermal Camera
Camera-level thermal imaging product format with coordinated mechanical packaging, electrical interfaces and system integration.
- Camera packaging
- Optical integration
- Interface adaptation
- System integration
- Application configuration
Reference platform / 03
Technical reference platform
A compact 640 × 512 LWIR platform for core-level integration, camera packaging and project-specific interface coordination.
640 × 512
Resolution
12 μm
Pixel pitch
21 × 21 mm
Reference format
33 mm
Approx. length
- Product format
- Compact thermal core / compact thermal camera
- Detector
- Uncooled VOx microbolometer
- Resolution
- 640 × 512 reference platform
- Pixel pitch
- 12 μm
- Spectral range
- 8–14 μm
- NETD
- ≤40 mK @ 300 K (reference)
- Frame rate
- ≤50 Hz (reference)
- Typical core power
- ≤0.6 W (reference)
- Mechanical format
- 21 × 21 mm reference; smaller formats subject to project confirmation
- Approx. reference length
- 33 mm
- Current interfaces
- USB / UVC / CVBS / PAL / UART
- Additional interfaces
- BT.656 / MIPI by configuration and validation
- Operating temperature
- -40°C to +60°C (reference)
Reference values describe the current 640 × 512 platform. Final mechanics, packaging, interfaces and performance are confirmed by project requirements.
Configuration flexibility / 04
A platform built around the system—not the other way around.
ELX coordinates product format, mechanics, interfaces and manufacturing scope around confirmed project requirements.
- 01
Smaller Mechanical Formats
21 × 21 mm is a reference platform. Tighter envelopes may be evaluated.
- 02
Core or Camera-Level Product
Products can be configured as compact cores or camera-level systems.
- 03
Interface Adaptation
Interfaces and connectors can be coordinated around host system requirements.
- 04
Engineering & Manufacturing Configuration
Assembly, integration, calibration and functional testing can be adapted to project requirements.
Core technologies / 05
Integration depth across the thermal imaging stack.
Engineering capability is applied at detector, optical, electronic, mechanical and validation levels without fixing the solution to a single product format.
- 01
Infrared Detector Integration
Integration and configuration of detector-level elements within the thermal imaging platform.
- 02
Optical Integration
Coordination of optics, focus requirements and mechanical interfaces for the application.
- 03
Image Processing & Calibration
Platform configuration, calibration support and image-output evaluation.
- 04
Embedded Electronics
Electronics and interface integration around host-system and payload requirements.
- 05
Mechanical Integration
Packaging, mounting and envelope coordination from compact core to camera system.
- 06
Testing & Validation
Functional testing and application-focused validation against agreed requirements.
Applications / 06
Thermal imaging where compact integration matters.
Platform configurations for airborne, robotic, industrial and OEM thermal imaging applications.
EO/IR payloads · Inspection UAVs
Airborne thermal inspection
Compact thermal imaging configured for payload and aerial inspection systems.
Application visualization
Robotics · Industrial monitoring
Autonomous inspection
Thermal sensing integrated into robotic monitoring platforms.
Application visualization
Embedded sensing · OEM thermal cameras
System-level integration
Core and camera configurations coordinated for intelligent systems.
Application visualization
Product workflow / 07
From configuration to production.
A practical product path from initial application requirements through evaluation, validation and manufacturing support.
01
Discuss
Requirements & use case
02
Configure
Core / camera / interfaces
03
Evaluate
Samples & integration review
04
Validate
Calibration & functional testing
05
Scale
Manufacturing & supply support
Scope and validation activities are confirmed for each project.
Manufacturing support / 08
Engineering & manufacturing support.
Structured support across assembly, calibration, testing, documentation and production—with scope confirmed for each project.
Applicable assembly, calibration, testing and production requirements are confirmed during project review.
01
Structured Assembly
Organize assembly activities around agreed product requirements and available work instructions.
02
Calibration Support
Coordinate calibration activities for the agreed thermal imaging configuration.
03
Functional Testing
Support functional checks and project-specific testing against agreed requirements.
04
Documentation
Maintain relevant production, test and follow-up information for clear communication.
05
Interface Coordination
Coordinate interfaces, connectors and open technical actions with system requirements.
06
Production Support
Support manufacturing execution and agreed follow-up as products move toward supply.
Project enquiry / 09
Let's build the right thermal configuration.
Discuss thermal imaging cores, camera configurations, integration requirements or engineering projects with ELX.
- info@elxtech.net
- +60 11-6165 6163